Semiconductor package and methods of manufacturing the same

Details Semiconductor package and methods of manufacturing the same Semiconductor package and methods of manufacturing the same

2010-02-12

2011-12-27

Loke, Steven (Department: 2818)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C257S758000, C257S774000

Reexamination Certificate

active

08084359

ABSTRACT:
A semiconductor package includes a semiconductor chip having first and second pads, a first insulation layer pattern formed on the semiconductor chip and having first and second openings that expose the first and the second pads, respectively, a first conductive layer pattern elongated along the first insulation layer pattern from the first pad, a first external terminal formed on the first conductive layer pattern, a second insulation layer pattern formed on the first conductive layer pattern and the first insulation layer pattern to expose the first external terminal and having a third opening in communication with the second opening, a second conductive layer pattern elongated along the second insulation layer pattern from the second pad, and a second external terminal formed on the second conductive layer pattern.

REFERENCES:
patent: 6717068 (2004-04-01), Motonishi et al.
patent: 6841875 (2005-01-01), Ohsumi
patent: 2004/0238929 (2004-12-01), Anzai et al.
patent: 2005/0070050 (2005-03-01), Murakami
patent: 2005/0087859 (2005-04-01), Chao et al.
patent: 2005/0277283 (2005-12-01), Lin et al.
patent: 2005-038932 (2005-02-01), None
patent: 10-0596797 (2006-06-01), None
U.S. Office Action for U.S. Appl. No. 11/877,520 dated Apr. 30, 2009.
U.S. Office Action for U.S. Appl. No. 11/877,520 dated Nov. 12, 2009.

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