Semiconductor multipackage module including processor and...

Details Semiconductor multipackage module including processor and... Semiconductor multipackage module including processor and...

2006-04-25

2006-04-25

Chambliss, Alonzo (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S780000, C257S782000, C361S760000, C361S764000, C361S770000

Reexamination Certificate

active

07034387

ABSTRACT:
A semiconductor multi-package module includes a processor and a plurality of memory packages mounted on a surface of the multipackage module substrate. In some embodiments the memory packages include stacked die packages, and in some embodiments the memory packages include stacked memory packages. In some embodiments the processor is situated at or near the center of the multipackage module substrate and the plurality of memory packages or of stacked memory package assemblies are situated on the multipackage module substrate adjacent the processor.

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