Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2009-06-15
2011-11-08
Clark, Jasmine (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S723000, C361S719000, C361S769000
Reexamination Certificate
active
08053889
ABSTRACT:
A semiconductor module including a module body and a shock absorbing member on an exposed surface of the module body is provided. The module body may include at least one semiconductor package on a substrate and the exposed surface of the module body may include exposed surfaces of the substrate and the at least one semiconductor package. In accordance with example embodiments, the module body may also include a heat transfer member on the at least one semiconductor package and an exposed surface of the module body may include an exposed surface of the heat transfer member.
REFERENCES:
patent: 6061243 (2000-05-01), Barnett et al.
patent: 6501658 (2002-12-01), Pearson et al.
patent: 7119436 (2006-10-01), Lien
patent: 2004-140195 (2004-05-01), None
patent: 10-2006-0025759 (2006-03-01), None
patent: 10-2007-0027189 (2007-03-01), None
Han Seong-chan
Oh Hyun-jong
Oh Nam-yong
Shin Dong-woo
Clark Jasmine
Harness & Dickey & Pierce P.L.C.
Samsung Electronics Co,. Ltd.
LandOfFree
Semiconductor module does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor module, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor module will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4256582