4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. With provision for cooling the housing or its contents

Nam-yong Oh

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Method of attaching a solder ball and method of repairing a...

Metal fusion bonding – Process – Plural joints
Reexamination Certificate

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Semiconductor module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Profile ID: LFUS-PAI-P-3309682

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