Semiconductor memory device which controls sense amplifier...

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Reexamination Certificate

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C365S149000, C365S190000

Reexamination Certificate

active

06396754

ABSTRACT:

The present application claims priority under 35 U.S.C. §119 to Korean Patent Application No. 2000-44578 filed on Aug. 1, 2000, which is hereby incorporated by reference in its entirety for all purposes.
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to semiconductor memory devices, and more particularly, to a semiconductor memory device which controls a sense amplifier for detecting a bit line bridge, and a method of controlling a sense amplifier.
2. Description of the Related Art
Due to a recent trend toward high integration of semiconductor memory devices, more delicate processing techniques are required. However, upon high integration and refining of semiconductor memory devices, the probability of various minute defects such as a bit line bridge, increases due to related difficulties in production of memory devices. In this case, a bit line bridge refers to generation of a resistance component between bit line layers due to dust or the like.
FIG. 1
is a schematic view illustrating a bit line bridge in a conventional semiconductor memory device. Referring to
FIG. 1
, a memory cell MC
0
is connected between a word line WL
1
and a bit line BL
1
, and a memory cell MC
2
is connected between the word line WL
1
and a bit line BL
2
. A memory cell MC
1
is connected between a word line WL
2
and a complementary bit line BL
1
B, and a memory cell MC
3
is connected between the word line WL
2
and a complementary bit line BL
2
B. Also, a bit line sense amplifier
10
is connected to the bit line BL
1
and the complementary bit line BL
1
B, and a bit line sense amplifier
15
is connected to the bit line BL
2
and the complementary bit line BL
2
B. In
FIG. 1
, a bridge R_BR is formed between the adjacent bit lines BL
1
B and BL
2
.
During the operation of the semiconductor memory device shown in
FIG. 1
, the bit line bridge R_BR may cause a charge sharing margin defect. That is, bit line leakage current is generated due to the bit line bridge R_BR. Consequently, a defect in a column direction is generated due to a deficiency in the margin of a charge sharing voltage (&Dgr;VBL) during normal reading.
The bit line leakage current can be expressed as in Equation 1:
IVBL
L
=
Δ



V

[
1
-
EXP

(
-


T
RC
)
]
(
1
)
wherein IVBL
L
denotes a leakage current on a bit line, &Dgr;V denotes a difference between the voltages of both ends of the bridge, T denotes a time during which current is leaked, R denotes the resistance value of the bridge R_BR, and C denotes a bit line capacitance. That is, the bit line leakage current IVBL
L
is determined by the resistance R of the bridge R_BR and the time during which current is leaked. According to Equation 1, the bit line leakage current IVBL
L
must be compulsorily increased in order to easily detect a charge sharing margin defect due to the bit line bridge R_BR. The current leakage time T can be considered as the time during which memory cells share charge with a bit line having initial voltage VBL.
FIGS. 2A through 2D
are waveform diagrams for illustrating a conventional bit line sensing operation. Referring to
FIG. 2
, T
21
and T
22
denote the charge sharing time of the bit lines BL
1
and BL
2
, respectively, and P
21
and P
22
denote the points in time of driving the sense amplifiers
10
and
15
, respectively. As shown in
FIG. 2
, in this conventional operation, the point in time of driving the sense amplifier
10
is the same as that of driving the sense amplifier
15
.
When data stored in the memory cell MC
2
is read, the cell transistors T
11
and T
13
of the memory cells MC
0
and MC
2
connected to the word line WL
1
are turned on. Assuming that data stored in the memory cells MC
0
and MC
2
are at high levels, the memory cells MC
0
and MC
2
share charge with the bit lines BL
1
and BL
2
having the initial voltage VBL, whereby the voltage level of each of the bit lines BL
1
and BL
2
is VBL+&Dgr;VBL (a charge sharing voltage). Each of the complementary bit lines BL
1
B and BL
2
B continuously has the initial voltage level VBL. Accordingly, a voltage &Dgr;V between both ends of the bit line bridge resistance R_BR of
FIG. 1
is the difference (&Dgr;VBL) between the voltage (i.e., VBL+&Dgr;VBL) of the bit line BL
2
and the voltage (i.e., VBL) of the complementary bit line BL
1
B.
However, in a case when the bit line bridge resistance is sufficiently large, like in the case of a microbridge, the level of the voltage &Dgr;V is small, so that the bit line leakage current IVBL
L
is also not so great, resulting in a deficient charge sharing margin. Thus, in the case when the bit line bridge resistance is sufficiently large, like in the case of a microbridge, even if the sense amplifiers
10
and
15
are simultaneously driven after charge sharing, the data stored in the memory cell MC
2
is normally sensed because the bit line leakage current IVBL
L
is very small.
Accordingly, in conventional semiconductor memory devices, a defect due to a bit line bridge is detected by a method of increasing the current leakage time (T) to compulsorily increase the bit line leakage current IVBL
L
. However, as described above, in the case that a bridge resistance is large, the amount of leakage current is very small although the current leakage time (T) is set to be long, so that defects cannot be accurately detected. Upon testing for detecting a defect of a semiconductor memory, detection of a bridge between layers becomes easier as the difference in voltage between two layers increases. Hence, this conventional method cannot be deemed to be easy in terms of voltage stress. Also, when the current leakage time (T) is artificially set to detect defects, process parameters such as the leakage current of a bit line must be considered.
SUMMARY OF THE INVENTION
The present invention is therefore directed to a method and apparatus for detecting bit line bridges, which substantially overcomes one or more of the problems due to the limitations and disadvantages of the related art.
To solve the above problems, it is an object of the present invention to provide a semiconductor memory device for controlling a sense amplifier, in which defects due to a bit line bridge can be effectively detected.
It is another object of the present invention to provide a sense amplifier controlling method performed in the semiconductor memory device.
It is still another object of the present invention to provide a bit line bridge detection method performed in the semiconductor memory device.
To achieve the first and other objects, the present invention provides a semiconductor memory device having memory cells connected to a plurality of word lines and a plurality of bit lines, the device including a row address strobe (RAS) signal delay unit, a sense amplifier control signal generator, a plurality of first sense amplifiers and a plurality of second sense amplifiers. The RAS signal delay unit delays a RAS signal for a predetermined period of time and outputs the delayed RAS signal. The sense amplifier control signal generator generates first and second sense amplifier control signals responsive to the delayed RAS signal and a test mode control signal, and which are enabled at the same time or at different periods in time depending on the operation modes of the semiconductor memory device. The first sense amplifiers sense and amplify the potential of a (2N−1)th (where N is a natural number that is equal to or greater than 1) bit line pair among the bit lines in response to the first sense amplifier control signal. The second sense amplifiers sense and amplify the potential of a 2N−th bit line pair among the bit lines in response to the second sense amplifier control signal. In the test mode, the first and second sense amplifier control signals are enabled at different points in time, so that the first and second sense amplifiers are activated at different points in time.
To achieve the second and other objects, the present invention provides a method of controlling

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