4. Electricity: conductors and insulators
  5. Boxes and housings
  6. Hermetic sealed envelope type

Harry R. Scholz

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Electronic component package using multi-level lead frames

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent

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Registration and assembly of integrated circuit packages

Metal fusion bonding – Process – Plural joints
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Semiconductor integrated circuit packages

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Semiconductor integrated circuit packages

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
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Profile ID: LFUS-PAI-P-336718

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