Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Patent
1999-06-23
2000-06-13
Powell, William
Semiconductor device manufacturing: process
Chemical etching
Vapor phase etching
438744, H01L 2100
Patent
active
06074958&
ABSTRACT:
To realize etching with a high selection ratio and a high accuracy in fabrication of an LSI, the composition of dissociated species of a reaction gas is accurately controlled when dry-etching a thin film on a semiconductor substrate by causing an inert gas excited to a metastable state in a plasma and a flon gas to interact with each other and selectively obtaining desired dissociated species.
REFERENCES:
patent: 4615756 (1986-10-01), Tsujii et al.
patent: 4966870 (1990-10-01), Barber et al.
patent: 5188975 (1993-02-01), Kojima et al.
patent: 5269879 (1993-12-01), Rhodes et al.
patent: 5290383 (1994-03-01), Koshimizu
patent: 5324388 (1994-06-01), Yamano et al.
patent: 5476182 (1995-12-01), Ishizuka et al.
patent: 5880036 (1999-03-01), Becker et al.
Kazumi Hideyuki
Mizutani Tatsumi
Okudaira Sadayuki
Tago Kazutami
Tokunaga Takafumi
Hitachi , Ltd.
Powell William
LandOfFree
Semiconductor integrated circuit arrangement fabrication method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor integrated circuit arrangement fabrication method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor integrated circuit arrangement fabrication method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2068507