Semiconductor fabrication using a collar

Details Semiconductor fabrication using a collar Semiconductor fabrication using a collar

2006-07-21

2009-06-02

Pert, Evan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Field effect device

Having insulated electrode

C257SE27094

Reexamination Certificate

active

07541635

ABSTRACT:
In one embodiment, a method includes selectively depositing a collar material between a number of memory containers. The collar material along a side of a first memory container of the number of memory containers is in contact with the collar material along a side of a second memory container. An opening exists between the collar material along a corner of the memory container and the collar material along a corner of a third memory container.

REFERENCES:
patent: 5994153 (1999-11-01), Nagel et al.
patent: 6121083 (2000-09-01), Matsuki
patent: 6180452 (2001-01-01), Figura
patent: 6190989 (2001-02-01), Roberts
patent: 7109089 (2006-09-01), Torek et al.
patent: 2005/0191805 (2005-09-01), Torek et al.

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