Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2006-08-22
2006-08-22
Coleman, W. David (Department: 2823)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S184000
Reexamination Certificate
active
07094694
ABSTRACT:
In a method for manufacturing a semiconductor device, a gate electrode is formed in a first region. A silicide blocking layer is patterned such that a first gate spacer is formed on sidewalls of the gate electrode, and a silicide blocking layer pattern is formed in a second region. A lightly doped source/drain region is formed on surface of the first region. A second gate spacer is formed on sidewalls of the first gate spacer. A heavily doped source/drain region is formed on the surface of the first region. A silicide layer is formed on the gate electrode and the heavily doped source/drain region in the first region.
REFERENCES:
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patent: 5883010 (1999-03-01), Merrill et al.
patent: 6338993 (2002-01-01), Lien
patent: 11097649 (1999-04-01), None
Cheong Kong-Soo
Kim Kyung-Soo
Youn Ki-Seog
Coleman W. David
Kim Su C.
Samsung Electronics Co,. Ltd.
Volentine Francos & Whitt PLLC
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