Semiconductor device and method of manufacturing the same

Details Semiconductor device and method of manufacturing the same Semiconductor device and method of manufacturing the same

2006-07-04

2006-07-04

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With specified encapsulant

C257S789000, C257S790000, C257S795000

Reexamination Certificate

active

07071576

ABSTRACT:
A semiconductor device includes a semiconductor substrate, a first wiring arranged on the semiconductor substrate, a first electrode pad electrically connected to the first wiring, and a porous organic resin film covering the front surface of the semiconductor substrate such that the first electrode pad is exposed to the outside.

REFERENCES:
patent: 4675985 (1987-06-01), Goto
patent: 5734201 (1998-03-01), Djennas et al.
patent: 6538315 (2003-03-01), Bessho et al.
patent: 6750550 (2004-06-01), Yamakawa et al.
patent: 2000-58592 (2000-02-01), None
patent: 2000-133683 (2000-05-01), None
patent: 2000-323605 (2000-11-01), None
patent: 2001-244362 (2001-09-01), None
patent: 2002-141436 (2002-05-01), None
patent: 2002-170848 (2002-06-01), None
Notification of Reasons for Rejection Issued by Japanese Patent Office mailed Mar. 7, 2006, in Japanese application No. 2003-188503, and English translation of Notice.

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