Semiconductor device and manufacturing method thereof

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S199000, C438S229000, C257S412000

Reexamination Certificate

active

07323381

ABSTRACT:
A structure of a MIS transistor for realizing a CMOS circuit capable of simultaneously achieving the high ON current and the low power consumption is provided. Each of the gate insulators of an n channel MIS transistor and a p channel MIS transistor is composed of a hafnium oxide (HfO2) film. Also, the gate electrode of the n channel MIS transistor is composed of an Ni (nickel) silicide film, and the gate electrode of the p channel MIS transistor is composed of a Pt (platinum) film. In this structure, Fermi level pinning of the gate electrodes can be prevented. Therefore, the increase of the threshold voltage of the n channel MIS transistor and the p channel MIS transistor can be inhibited.

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Hobbs et al., “Fermi-Level Pinning at the Polysilicon/Metal Oxide Interface—Part I”, IEEE Transactions of Electron Devices, vol. 51. No. 6, Jun. 2004, pp. 971-984.

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