Semiconductor device and manufacturing method of the same

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S218000, C438S219000, C257S375000

Reexamination Certificate

active

07396715

ABSTRACT:
Patterning is performed in such a manner that an end portion fabricated of a second gate insulating film partially overlaps an end portion fabricated of a first gate insulating film. Then, a surface recovery treatment is performed in the aforementioned state where the first and second gate insulating films partially overlap each other.

REFERENCES:
patent: 5254489 (1993-10-01), Nakata
patent: 6184083 (2001-02-01), Tsunashima et al.
patent: 6538278 (2003-03-01), Chau
patent: 6597046 (2003-07-01), Chau et al.
patent: 2000-188338 (2000-07-01), None
Patent Abstracts of Japan, Publication No. 2000188338, filed on Jul. 4, 2000.
Patent Abstracts of Japan, Publication No. 2003023100, filed Jan. 24, 2003.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor device and manufacturing method of the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device and manufacturing method of the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and manufacturing method of the same will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3963160

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.