Semiconductor device and its manufacture method

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S391000

Reexamination Certificate

active

07605041

ABSTRACT:
Multiple kinds of transistors exhibiting desired characteristics are manufactured in fewer processes. A semiconductor device includes an isolation region reaching a first depth, first and second wells of first conductivity type, a first transistor formed in the first well and having a gate insulating film of a first thickness, and a second transistor formed in the second well and having a gate insulating film of a second thickness less than the first thickness. The first well has a first impurity concentration distribution having an extremum maximum value only at the depth equal to or greater than the first depth. The second well has a second impurity concentration distribution which is superposition of the first impurity concentration distribution, and another impurity concentration distribution which shows an extremum maximum value at a second depth less than the first depth, the superposition shows also an extremum maximum value at the second depth.

REFERENCES:
patent: 6184094 (2001-02-01), Goto
patent: 6228697 (2001-05-01), Furukawa et al.
patent: 6479346 (2002-11-01), Yi et al.
patent: 6569742 (2003-05-01), Taniguchi et al.
patent: 8-204022 (1996-08-01), None
patent: 8-204025 (1996-08-01), None
patent: 9-45792 (1997-02-01), None
patent: 11-4004 (1999-01-01), None
patent: 11-135750 (1999-05-01), None
patent: 2000-150662 (2000-05-01), None
patent: 2000-216268 (2000-08-01), None
patent: 2001-85533 (2001-03-01), None
patent: 2000-0048212 (2000-07-01), None
patent: 2000-73371 (2000-12-01), None
Korean Office Action of Corresponding Application No. 10-2005-7009649 dated Oct. 30, 2006.
Chinese Office Action of Corresponding Application No. 038253836 dated Apr. 20, 2007.
Supplemental European Search Report; Application No. 03816642.7-2003/1612861, PCT/JP0304589 dated Aug. 8, 2008.
Japanese Office Action mailed Mar. 17, 2009, issued in corresponding Japanese Application No. 2004-570847.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor device and its manufacture method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device and its manufacture method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and its manufacture method will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4055740

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.