Semiconductor component having a semiconductor chip mounted to a

Details Semiconductor component having a semiconductor chip mounted to a Semiconductor component having a semiconductor chip mounted to a

1998-06-22

2000-06-27

Clark, Sheila V.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

257706, 257707, H01L 2310, H01L 2334

Patent

active

060810378

ABSTRACT:
A semiconductor device (30) includes a semiconductor chip (11) flip chip mounted on a substrate (21) and a thermally conductive chip mount (31) mounded on the semiconductor chip (11). The thermally conductive chip mount (31) has a cavity (34) formed therein. The semiconductor chip (11) fits in the cavity (34) and is thermally coupled to the thermally conductive chip mount (31). The thermally conductive chip mount (31) provides a thermal conduction path to dissipate heat generated in the semiconductor chip (11) through its sidewalls (15, 16, 17, 18).

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