4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Flip chip

Tien-Yu Tom Lee

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active

Electronic component and method of manufacturing same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Semiconductor component having a semiconductor chip mounted to a

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Patent

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Structure and method of thermally protecting power devices...

Electricity: electrical systems and devices – Safety and protection of systems and devices – Load shunting by fault responsive means
Reexamination Certificate

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System and method for cooling using an oscillatory impinging...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate

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System and method to control solder reflow furnace with...

Metal fusion bonding – Process – With condition responsive – program – or timing control
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Profile ID: LFUS-PAI-P-1673347

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