Semiconductor chip used in flip chip process

Details Semiconductor chip used in flip chip process Semiconductor chip used in flip chip process

2010-03-02

2010-12-14

Luu, Chuong A (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S738000, C257SE23068

Reexamination Certificate

active

07851911

ABSTRACT:
A semiconductor chip for forming the same. The semiconductor chip includes M regular solder bump structures and N monitor solder bump structures, M and N being positive integers. If a flip chip process is performed for the semiconductor chip, then the N monitor solder bump structures are more sensitive to a cool-down stress than the M regular solder bump structures. The cool-down stress results from a cool-down step of the flip chip process. Each of the M regular solder bump structures is electrically connected to either a power supply or a device of the semiconductor chip. Each of the N monitor solder bump structures is not electrically connected to a power supply or a device of the semiconductor chip.

REFERENCES:
patent: 6014317 (2000-01-01), Sylvester
patent: 6979600 (2005-12-01), Brandenburger
patent: 2002/0093096 (2002-07-01), Tago et al.
patent: 2006/0055054 (2006-03-01), Kondo et al.
patent: 2008/0113457 (2008-05-01), Tsay et al.
Notice of Allowance (Mail Date Oct. 22, 2009) for U.S. Appl. No. 11/749,885, filed May 17, 2007; Confirmation No. 9066.

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