Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2010-03-02
2010-12-14
Luu, Chuong A (Department: 2813)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257S738000, C257SE23068
Reexamination Certificate
active
07851911
ABSTRACT:
A semiconductor chip for forming the same. The semiconductor chip includes M regular solder bump structures and N monitor solder bump structures, M and N being positive integers. If a flip chip process is performed for the semiconductor chip, then the N monitor solder bump structures are more sensitive to a cool-down stress than the M regular solder bump structures. The cool-down stress results from a cool-down step of the flip chip process. Each of the M regular solder bump structures is electrically connected to either a power supply or a device of the semiconductor chip. Each of the N monitor solder bump structures is not electrically connected to a power supply or a device of the semiconductor chip.
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Carey Charles F.
Hansen Bernt Julius
Malhotra Ashwani K.
Questad David L.
Sauter Wolfgang
Doan Nga
International Business Machines - Corporation
Kotulak Richard M.
Luu Chuong A
Schmeiser Olsen & Watts
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