4. Electrolysis: processes, compositions used therein, and methods
  5. Electrolytic coating
  6. Coating selected area

Charles F. Carey

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Extension of fatigue life for C4 solder ball to chip connection

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Extension of fatigue life for C4 solder ball to chip connection

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Low temperature controlled collapse chip attach process

Metal working – Method of mechanical manufacture – Electrical device making
Patent

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Package for electronic component

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Reexamination Certificate

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Process for selective application of solder to circuit packages

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating selected area
Patent

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Profile ID: LFUS-PAI-P-1114487

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