Semiconductor chip and method of fabricating the same

Details Semiconductor chip and method of fabricating the same Semiconductor chip and method of fabricating the same

2008-06-10

2008-06-10

Zarneke, David A (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

With means to control surface effects

Insulating coating

C257SE23002

Reexamination Certificate

active

07385277

ABSTRACT:
A semiconductor chip may include a semiconductor substrate that may have a semiconductor device pattern. A passivation layer may be provided on a surface of the semiconductor substrate. At least one elastic protecting layer may be provided on the passivation layer. The elastic protecting layer may have a pattern composed of grooves formed on a surface.

REFERENCES:
patent: 4904610 (1990-02-01), Shyr
patent: 6335561 (2002-01-01), Imoto
patent: 6429042 (2002-08-01), Guida
patent: 6576990 (2003-06-01), Flesher et al.
patent: 6897164 (2005-05-01), Baude et al.
patent: 7129565 (2006-10-01), Watanabe et al.
patent: 7170152 (2007-01-01), Huang et al.
patent: 7198969 (2007-04-01), Khandros et al.
patent: 2006/0076649 (2006-04-01), Letertre et al.
patent: 10-2001-0001597 (2001-01-01), None
patent: 10-2005-0047873 (2005-05-01), None
On the Mechanism of Thymine Photodimerization□□by A. A. Lamola and J. Eisinger□□Bell Telephone Laboratories, Murray Hill, New Jersey□□Communicated by W. O. Baker, Oct. 30, 1967.

Affiliated with

Also associated with

Rating

Semiconductor chip and method of fabricating the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor chip and method of fabricating the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor chip and method of fabricating the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2806961