4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame

Lixiong Luo

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active

IC chip package with directly connected leads

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Semiconductor assembly with package using cup-shaped lead-frame

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Semiconductor die package including cup-shaped leadframe

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2098915

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