4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package

Wei-Bing Chu

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active

Semiconductor assembly with package using cup-shaped lead-frame

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Semiconductor die package including cup-shaped leadframe

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2789614

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