4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. For plural devices

Y. Mohammed Kasem

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Chip scale surface mount package for semiconductor device...

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Substrate dicing
Reexamination Certificate

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Chip scale surface mount package for semiconductor device...

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With peripheral feature due to separation of smaller...
Reexamination Certificate

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Chip scale surface mount package for semiconductor device...

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With peripheral feature due to separation of smaller...
Reexamination Certificate

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Chip scale surface mount package for semiconductor device...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Chip scale surface mount packages for semiconductor device...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

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Profile ID: LFUS-PAI-P-1702313

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