Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate
2005-09-06
2005-09-06
Thai, Luan (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Ball or nail head type contact, lead, or bond
C257S737000, C257S778000, C257S738000, C257S779000
Reexamination Certificate
active
06940178
ABSTRACT:
A stud bump structure for electrical interconnection between a pair of members includes a base portion, and a stem portion. The base portion is affixed to a pad or trace in one of the pair of members to be interconnected (such as an integrated circuit chip), and the stem end is configured to contact a metal pad on the other member (such as a printed circuit board) to complete the interconnect. According to the invention, the stem end is truncated to form a transverse plane, and the stem is more compliant than the base. Also, a method for forming a stud bump on a contact surface, includes forming a bump base portion on the surface, drawing out a generally conical tail from a top of the base, and truncating the tail to form a stem portion having a planar transverse top surface and having a length from the top of the base portion to the top surface. In some embodiments the tail portion, at least, of the stud bump is formed using a wire bonding tool. Also, a method for forming an interconnect between a first member and a second member of an electronic package includes providing one of the members with the stud bumps of the invention and then bringing the corresponding bumps and pads together in a bonding process, the compliance of the stems portions of the bumps accommodating the variance from coplanarity of the pad surfaces.
REFERENCES:
patent: 4000842 (1977-01-01), Burns
patent: 4208005 (1980-06-01), Nate et al.
patent: 4818728 (1989-04-01), Rai et al.
patent: 5210938 (1993-05-01), Hirai
patent: 5250469 (1993-10-01), Tanaka et al.
patent: 5346857 (1994-09-01), Scharr et al.
patent: 5386624 (1995-02-01), George et al.
patent: 5508561 (1996-04-01), Tago et al.
patent: 5592736 (1997-01-01), Akram et al.
patent: 5633204 (1997-05-01), Tago et al.
patent: 5686317 (1997-11-01), Akram et al.
patent: 5717477 (1998-02-01), Fritz et al.
patent: 5801350 (1998-09-01), Shibuya et al.
patent: 5829126 (1998-11-01), Nagao et al.
patent: 5865365 (1999-02-01), Nishikawa et al.
patent: 5869904 (1999-02-01), Shoji
patent: 5874780 (1999-02-01), Murakami
patent: 5875100 (1999-02-01), Yamashita
patent: 5889326 (1999-03-01), Tanaka
patent: 5892271 (1999-04-01), Takeda et al.
patent: 5892289 (1999-04-01), Tokuno
patent: 5931371 (1999-08-01), Pao et al.
patent: 5953814 (1999-09-01), Sozansky et al.
patent: 6006426 (1999-12-01), Kira et al.
patent: 6037192 (2000-03-01), Witzman et al.
patent: 6130476 (2000-10-01), LaFontaine, Jr. et al.
patent: 6153940 (2000-11-01), Zakel et al.
patent: 6163463 (2000-12-01), Marrs
patent: 6173887 (2001-01-01), Mead et al.
patent: 6214642 (2001-04-01), Chen et al.
patent: 6225144 (2001-05-01), How et al.
patent: 6326234 (2001-12-01), Nakamura
patent: 6333554 (2001-12-01), Kitajima et al.
patent: 6337522 (2002-01-01), Kang et al.
patent: 6376352 (2002-04-01), Arnold et al.
patent: 6459592 (2002-10-01), Anzai
patent: 2000-299338 (2000-10-01), None
Ahmad Nazir
Kim Kyung-Moon
Kweon Young-Do
Pendse Rajendra
ChipPAC, Inc.
Haynes Beffel & Wolfold LLP
Kennedy Bill
Thai Luan
LandOfFree
Self-coplanarity bumping shape for flip chip does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Self-coplanarity bumping shape for flip chip, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Self-coplanarity bumping shape for flip chip will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3448651