4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor

Rajendra Pendse

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Chip scale package with flip chip interconnect

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Process for precise encapsulation of flip chip interconnects

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Reexamination Certificate

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Self-coplanarity bumping shape for flip chip

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2693787

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