Selective provision of a diblock copolymer material

Details Selective provision of a diblock copolymer material Selective provision of a diblock copolymer material

2004-05-06

2009-12-01

Davis, Daborah Chacko (Department: 1795)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Forming nonplanar surface

C430S313000, C430S330000, C427S472000, C427S098300, C427S385500

Reexamination Certificate

active

07625694

ABSTRACT:
Disclosed herein are techniques for using diblock copolymer (DBCP) films as etch masks to form small dots or holes in integrated circuit layers. In an embodiment, the DBCP film is deposited on the circuit layer to be etched. Then the DCBP film is confined to define an area of interest in the DCBP film in which hexagonal domains will eventually be formed. Such confinement can constitute masking and exposing the DCBP film using photolithographic techniques. Such masking preferably incorporates knowledge of the domain spacing and/or grain size of the to-be-formed domains in the area of interest to ensure that a predictable number and/or orientation of the domains will result in the area of interest, although this is not strictly necessary in all useful embodiments. Domains are then formed in the area of interest in the DBCP film which comprises a hexagonal array of cylindrical domains in a matrix. The film is then treated (e.g., with osmium or ozone) to render either the domains or the matrix susceptible to removal, while the other component is then used as a mask to etch either dots or holes in the underlying circuit layer.

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