Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Patent
1999-03-05
2000-10-31
Nguyen, Nam
Chemistry: electrical and wave energy
Processes and products
Coating, forming or etching by sputtering
20419235, G23C 1434
Patent
active
061397024
ABSTRACT:
A seasoning process for an etcher which is performed before etching a dielectric layer to expose a metal silicide layer. The seasoning process includes the first plasma sputtering process and the second plasma sputtering process. A wafer containing the metal silicide layer thereon is placed in the etcher with an etchant and the first plasma sputtering process is performed. Several silicon wafers are successively placed in the etcher to perform the second plasma sputtering process.
REFERENCES:
patent: 6014979 (2000-01-01), Van Autryve et al.
patent: 6020641 (2000-02-01), Lee et al.
Chen Tong-Yu
Huang Michael W C
Yang Chan-Lon
Nguyen Nam
United Microelectronics Corp.
VerSteeg Steven H.
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