Seasoning of a semiconductor wafer polishing pad to polish tungs

Details Seasoning of a semiconductor wafer polishing pad to polish tungs Seasoning of a semiconductor wafer polishing pad to polish tungs

1997-10-31

2000-04-18

Everhart, Caridad

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438633, 438692, 451 41, 451 56, H01L 21463

Patent

active

060514957

ABSTRACT:
A tungsten prepper for seasoning a semiconductor wafer polishing pad to polish tungsten on a semiconductor wafer. The prepper includes a support device having a first surface and a seasoning layer attached to the first surface of the support device. The seasoning layer is made of a seasoning material for seasoning a polishing pad to polish tungsten. In one embodiment, the seasoning layer is flame sprayed on the surface of the support device. In another embodiment, the tungsten is inserted into notches in the surface. The seasoning material includes tungsten, and in some embodiments, an adhesion promoter such as nickel. The prepper can be attached to a conditioning arm of a Chemical Mechanical Polisher. The prepper can be used to season a new polishing pad until the tungsten polishing rate of the pad is above 4000 angstroms per minute. The prepper can also include conditioners to condition a pad while seasoning the pad.

REFERENCES:
patent: 4031278 (1977-06-01), Patel
patent: 5244534 (1993-09-01), Yu et al.
patent: 5674352 (1997-10-01), Yu et al.
patent: 5707492 (1998-01-01), Stager et al.
patent: 5890951 (1999-04-01), Vu

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