Rotating pallet in sputtering system

Details Rotating pallet in sputtering system Rotating pallet in sputtering system

2005-04-14

2010-06-29

Nguyen, Nam X (Department: 1795)

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

C204S298160, C204S298190, C204S298200, C204S298250, C204S298350, C204S192100

Reexamination Certificate

active

07744730

ABSTRACT:
A processing system is described for depositing materials on multiple workpieces (wafers, display panels, or any other workpieces) at a time in a vacuum chamber. Multiple targets, of the same or different materials, may concurrently deposit material on the wafers as the pallet is rotating. Multiple magnets (one for each target) in the magnetron assembly in the sputtering chamber oscillate back and forth across an arc over their respective targets for uniform target erosion and uniform deposition on the wafers.

REFERENCES:
patent: 5669977 (1997-09-01), Shufflebotham et al.
patent: 6233988 (2001-05-01), Kojima
patent: 6254747 (2001-07-01), Hoshino et al.
patent: 6592675 (2003-07-01), Nishikawa
patent: 6641703 (2003-11-01), Nomura et al.
patent: 7156961 (2007-01-01), Okatani et al.
patent: 2003/0217913 (2003-11-01), Hong et al.
patent: 2707144 (1977-08-01), None
patent: 10102247 (1998-04-01), None
Machine Translation to Corbani, published Aug. 1977.

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