Coating apparatus – Gas or vapor deposition – With treating means
Patent
1995-02-15
1998-05-19
Tsai, Jey
Coating apparatus
Gas or vapor deposition
With treating means
118723IR, C23C 1600
Patent
active
057530440
ABSTRACT:
An inductively coupled RF plasma reactor for processing semiconductor wafer includes a reactor chamber having a side wall and a ceiling, a wafer pedestal for supporting the wafer in the chamber, an RF power source, apparatus for introducing a processing gas into the reactor chamber, and a coil inductor adjacent the reactor chamber connected to the RF power source, the coil inductor including (a) a side section facing a portion of the side wall and including a bottom winding and a top winding, the top winding being at a height corresponding at least approximately to a top height of the ceiling, and (b) a top section extending radially inwardly from the top winding of the side section so as to overlie at least a substantial portion of the ceiling.
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Hanawa Hiroji
Loewenhardt Peter
Ma Diana X.
Salzman Phil M.
Yin Gerald Zheyao
Applied Materials Inc.
Chang Joni Y.
Tsai Jey
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