Resist polymer, resist composition and patterning process

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

Reexamination Certificate

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C430S910000, C430S326000, C430S330000, C430S327000, C526S266000, C526S268000

Reexamination Certificate

active

07135270

ABSTRACT:
A polymer comprising recurring units of formulae (1), (2), (3) and (4) increases a dissolution rate in an alkali developer under the action of an acid.R1, R2, R3and R6are H or CH3, R4and R5are H or OH, X is a tertiary exo-alkyl group having a bicyclo[2.2.1]heptane framework, represented by any of formulae (X-1) to (X-4):wherein R7is C1–C10alkyl, and Y is a tertiary alkyl group having an adamantane structure. A resist composition comprising the inventive polymer has a sensitivity to high-energy radiation, improved resolution and minimized proximity bias and lends itself to micropatterning with electron beams or deep UV for VLSI fabrication.

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patent: 2003-84438 (2003-03-01), None

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