Replacement gate process for making a semiconductor device...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S230000, C438S303000, C438S595000, C257S204000, C257S412000, C257SE21626, C257SE21632, C257SE21640

Reexamination Certificate

active

10809853

ABSTRACT:
A method for making a semiconductor device is described. That method comprises forming a polysilicon layer on a dielectric layer, which is formed on a substrate. The polysilicon layer is etched to generate a patterned polysilicon layer with an upper surface that is wider than its lower surface. The method may be applied, when using a replacement gate process to make transistors that have metal gate electrodes.

REFERENCES:
patent: 4128845 (1978-12-01), Sakai
patent: 5342481 (1994-08-01), Kadomura
patent: 5834816 (1998-11-01), Jang
patent: 5880033 (1999-03-01), Tsai
patent: 6018179 (2000-01-01), Gardner et al.
patent: 6060375 (2000-05-01), Owyang et al.
patent: 6063698 (2000-05-01), Tseng et al.
patent: 6171910 (2001-01-01), Hobbs et al.
patent: 6184072 (2001-02-01), Kaushik et al.
patent: 6242312 (2001-06-01), Huang et al.
patent: 6255698 (2001-07-01), Gardner et al.
patent: 6352867 (2002-03-01), Couteau et al.
patent: 6365450 (2002-04-01), Kim
patent: 6410376 (2002-06-01), Ng et al.
patent: 6420279 (2002-07-01), Ono et al.
patent: 6433371 (2002-08-01), Scholer et al.
patent: 6475874 (2002-11-01), Xiang et al.
patent: 6514828 (2003-02-01), Ahn et al.
patent: 6544906 (2003-04-01), Rotondaro et al.
patent: 6586288 (2003-07-01), Kim et al.
patent: 6617209 (2003-09-01), Chau et al.
patent: 6617210 (2003-09-01), Chau et al.
patent: 6620713 (2003-09-01), Arghavani et al.
patent: 6635922 (2003-10-01), Hsieh et al.
patent: 6642131 (2003-11-01), Harada
patent: 6667246 (2003-12-01), Mitsuhashi et al.
patent: 6689675 (2004-02-01), Parker et al.
patent: 6696327 (2004-02-01), Brask et al.
patent: 6696345 (2004-02-01), Chau et al.
patent: 6743683 (2004-06-01), Barns et al.
patent: 6784491 (2004-08-01), Doyle et al.
patent: 6995434 (2006-02-01), Usui et al.
patent: 2002/0058374 (2002-05-01), Kim et al.
patent: 2002/0197790 (2002-12-01), Kitzilyalli et al.
patent: 2003/0032303 (2003-02-01), Yu et al.
patent: 2003/0045080 (2003-03-01), Visokay et al.
patent: 0 899 784 AZ (1999-03-01), None
patent: 2 358 737 (2001-04-01), None
Polishchuk et al., “Dual Workfunction CMOS Gate Technology Based on Metal Interdiffusion”, www.eesc.berkeley.edu, 1 page.
Doug Barlage et al., “High-Frequency Response of 100nm Integrated CMOS Transistors with High-K Gate Dielectrics”, 2001 IEEE, 4 pages.
Lu et al., “Dual-Metal Gate Technology for Deep-Submicron CMOS Devices”, dated Apr. 29, 2003, 1 page.
Schwantes et al., “Performance Improvement of Metal Gate CMOS Technologies with Gigabit Feature Sizes”, Technical University of Hanburg-Harburg, 5 pages.
Doczy et al., “Integrating N-type and P-type Metal Gate Transistors,” U.S. Appl. No. 10/327,293, filed Dec. 20, 2002.
Brask et al., “A Method for Making a Semiconductor Device Having a Metal Gate Electrode,” U.S. Appl. No. 10/704,497, filed Nov. 6, 2003.
Brask et al., “A Method for Etching a Thin Metal Layer”, U.S. Appl. No. 10/704,498, filed Nov. 6, 2003.
Brask et al., “A Method for Making a Semiconductor Device with a Metal Gate Electrode that is Formed on an Annealed High-K Gate Dielectric Layer”, U.S. Appl. No. 10/742,678, filed Dec. 19, 2003.
Brask et al., “A Method for Making a Semiconductor Device that includes a Metal Gate Electrode”, U.S. Appl. No. 10/739,173, filed Dec. 18, 2003.
Brask et al., “A CMOS Device With Metal and Silicide Gate Electrodes and a Method for Making It”, U.S. Appl. No. 10/748,559, filed Dec. 29, 2003.
Doczy et al., “A Method for Making a Semiconductor Device that Includes a Metal Gate Electrode”, U.S. Appl. No. 10/748,545, filed Dec. 29, 2003.

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