Reduced stress tungsten deposition

Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering

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430 5, 216 12, C23C 1400, C23C 1432

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056205732

ABSTRACT:
X-ray masks are typically made by depositing and patterning a layer of heavy metal on a thin supporting membrane. The metal layer must have a relatively low and uniform stress to prevent stress-induced deformation of the pattern. Tungsten films having excellent stress characteristics are produced by employing a continuously operating capacitance-based measurement technique to allow adjustment of the deposition conditions in rapid response to changes in stress of the film being deposited. The stress gradients in the film are further reduced by transferring heat from the membrane as the metal is deposited thereon.

REFERENCES:
patent: 4893071 (1990-01-01), Miller
patent: 5382340 (1995-01-01), Kola et al.
patent: 5480529 (1996-01-01), Kola et al.
"Uniform-Stress Tungsten on X-Ray Mask Membranes Via He-backside Temperature Homogenization" by Mondol, M. et al., J. Vac. Sci. Technol. B 12(6), pp. 4024-4027 (Nov. 1994).
"Tungsten Patterning for 1:1 X-Ray Masks", by Jurgensen, C.W. et al, J. Vac. Sci. Technol. B 9 (6), pp. 3280-3286 (Nov. 1991).
"Control of Optical and Mechanica Properties of Polycrystalline Silicon Membranes for X-Ray Masks", Trimble, L.E., Celler, G.K., Frackoviak, J., SPIE, vol. 1263, Electron-Beam, X-Ray, and Ion-Beam Technology: Submicrometer Lithographies IX, pp. 251-258, (1990).
"In Situ Stress Monitoring and Deposition of Zero-Stress W for X-Ray Masks", Ku, Y.-C., Ng, L.-P., Carpenter, R., Lu, K., Smith, H.I., Haas, L.E., Plotnik, I., Journal Vacuum Science Technology, B, vol. 9, No. 6, pp. 3297-3300, Nov./Dec. 1991.
"Stable Low-Stress Tungsten Absorber Technology for Sub-Half-Micron X-Ray Lithography", Kola, R.R., Celler, G.K., Frackoviak, J. Jurgensen, C.W., Trimble, L.E., Journal Vacuum Science Technology, B, vol. 9, No. 6, pp. 3301-3305, (Nov./Dec. 1991).
"A Feedback Method for Investigating Carrier Distributions in Semiconductors", Miller, G.L., IEEE Transactions on Electron Devices, vol. ED-19, No. 10, pp. 1103-1108, (Oct. 1972).
"Uniform-Stress Tungsten on X-Ray Mask Membranes Via He-Backside Temperature Homogenization", Mondol, M., Li, H. Owen, G., Smith, H.I., Journal Vacuum Science Technology, B. 12(6), pp. 4024-4027, (Nov./Dec. 1994).
Jurgensen, C.W., Kola, R.R., Novembre, A.E., Tai, W.W., Frackoviak, J., Trimble, L.E., Celler, G.K., "Tungsten Patterning for 1:1 X-Ray Masks", J. Vac. Sci. Technol. B 9 (6), pp. 3280-3286 (Nov./Dec. 191).

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