Reclaiming substrates having defects and contaminants

Data processing: measuring – calibrating – or testing – Testing system

Reexamination Certificate

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Details

C438S016000, C700S121000

Reexamination Certificate

active

07657390

ABSTRACT:
Test substrates used to test semiconductor fabrication tools are reclaimed by reading from a database the process steps performed on each test substrate and selecting a reclamation process from a plurality of reclamation processes. The reclamation process can include crystal lattice defect or metallic contaminant reduction treatments for reclaiming each test substrate. Each test substrate is sorted and placed into a group of test substrates having a common defect or contaminant reduction treatment assigned to the test substrates of the group. Additional features are described and claimed.

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Hua et al., Studies on Stacking Faults & Crystalline Defects in FabricationSilicon Wafer Substrate, 1998, Chartered Semiconductor Manufacturing Ltd., p. 1-8.

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