Reaction chamber design and method to minimize particle generati

Details Reaction chamber design and method to minimize particle generati Reaction chamber design and method to minimize particle generati

1990-12-11

1993-04-06

Padgett, Marianne

Coating processes

Direct application of electrical, magnetic, wave, or...

Plasma

118719, 118723, 118724, 118725, B05D 306, C23C 1600

Patent

active

052002322

ABSTRACT:
A method of controlling deposition quality of line-of-sight and specimen surrounding surfaces in a plasma-enhanced chemical vapor deposition apparatus. Adhesion and integrity of deposited film on the surfaces is improved by one or more of (1) avoiding differential thermal expansion of the film and the underlying surfaces, (2) controlling geometry of the surfaces to eliminate edges which generate stress in the deposited film, and (3) using material for the surface which provides strong adhesion of the deposited film. For instance, differential thermal expansion can be avoided by maintaining the surfaces at a substantially constant temperature such as ambient temperature.

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