PVD method and PVD apparatus

Details PVD method and PVD apparatus PVD method and PVD apparatus

2006-04-04

2006-04-04

Versteeg, Steven (Department: 1753)

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

C204S298200, C204S298220

Reexamination Certificate

active

07022209

ABSTRACT:
A PVD method and a PVD apparatus use a rotating magnetic field in order to increase the yield. The magnetic field is provided such that it essentially vanishes, at least in a time average, outside a rotation axis of the magnetic field in sectors of the target region of the PVD apparatus. In this manner the PVD method and the PVD apparatus achieve a uniform coating.

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