Processing method and equipment for processing a semiconductor d

Details Processing method and equipment for processing a semiconductor d Processing method and equipment for processing a semiconductor d

1995-03-03

1997-05-13

Bueker, Richard

Coating apparatus

Gas or vapor deposition

Multizone chamber

414217, 414939, 4272481, C23C 1600

Patent

active

056288280

ABSTRACT:
Process equipment and method for processing a semiconductor device comprising a buffer chamber, at least one process chamber connected to the buffer chamber through an opening portion, a holding/carrying unit disposed at a position facing the opening portion for holding and carrying a member to be processed such as a wafer, and a carrier unit disposed in the buffer chamber for transferring the member to be processed to and from the holding/carrying unit. The holding/carrying unit includes a flattened surface closely facing the opening portion for holding an atmosphere in the at least one process chamber independently from an atmosphere in the buffer chamber. The opening portion has a flattened surface closely facing the flattened surface of the holding/carrying unit.

REFERENCES:
patent: 4825806 (1989-05-01), Tawada
patent: 4869976 (1989-09-01), Tawada
patent: 4951601 (1990-08-01), Maydan
patent: 5016562 (1991-05-01), Maydan
patent: 5076205 (1991-12-01), Vowles
patent: 5088908 (1992-02-01), Ezaki
patent: 5259881 (1993-11-01), Edwards
patent: 5286296 (1994-02-01), Sato
patent: 5288379 (1994-02-01), Namiki
patent: 5292393 (1994-03-01), Maydan
patent: 5344542 (1994-09-01), Maher
patent: 5486080 (1996-01-01), Sieradzki

Affiliated with

Also associated with

Rating

Processing method and equipment for processing a semiconductor d does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Processing method and equipment for processing a semiconductor d, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Processing method and equipment for processing a semiconductor d will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1381997