Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – For liquid etchant
Reexamination Certificate
2007-01-30
2007-01-30
Deo, Duy-Vu N. (Department: 1765)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
For liquid etchant
C156S345150, C156S345170, C156S345180, C156S345290
Reexamination Certificate
active
10909764
ABSTRACT:
A method and system for cleaning and/or stripping photoresist from photomasks used in integrated circuit manufacturing comprising a process and means of introducing a mixture of sulfuric acid and ozone (or a mixture of sulfuric acid and hydrogen peroxide) to the surface of a photomask while applying megasonic energy. The invention also comprises method and system comprising a process and means of introducing ozonated deionized water and/or a low temperature dilute aqueous solution (dAPM) to the surface of photomasks while applying megasonic energy. The process and apparatus also remove post plasma ashed residues and other contaminants from photomask surfaces.
REFERENCES:
patent: 2002/0011254 (2002-01-01), Puri et al.
patent: 2002/0157666 (2002-10-01), Kenney et al.
patent: 2003/0045098 (2003-03-01), Verhaverbeke et al.
patent: 2003/0172954 (2003-09-01), Verhaverbeke
patent: 2004/0139985 (2004-07-01), Hegedus et al.
patent: 2004/0154641 (2004-08-01), Montierth
patent: 2002/0221877 (2004-11-01), Bergman
patent: 2004/0221877 (2004-11-01), Bergman
Chen Gim-Syang
Kashkoush Ismail
Novak Richard
Akrion Technologies, Inc.
Belles Brian L.
Deo Duy-Vu N.
Wolf Block Schorr & Solis-Cohen
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