Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1977-04-14
1979-12-18
Bernstein, Hiram H.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156613, B01J 1726
Patent
active
041793269
ABSTRACT:
Disclosed herewith is an improvement of the conventional process for the vapor growth of a thin film, such as the films of SiO.sub.2, Si.sub.3 N.sub.4, Al.sub.2 O.sub.3 and polycrystalline Si, on a plurality of wafers, such as wafers of a semiconductor, under a reduced pressure. This improved process allows the growing of a uniformly thin film on each piece of wafer. According to the present invention, the location of the wafers is changed in accordance with a specific pressure within the reaction tube.
REFERENCES:
patent: 3657004 (1972-04-01), Merkel et al.
patent: 3922467 (1975-11-01), Pinchon
patent: 4018183 (1977-04-01), Meuleman
Kudo Daiziro
Maeda Kazuo
Tanikawa Eiki
Bernstein Hiram H.
Fujitsu Limited
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