Process for removing etching residues, etching mask and silicon

Semiconductor device manufacturing: process – Chemical etching – Liquid phase etching

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

438757, 438906, 438963, 216 99, 252 793, 252 794, 134 13, 134902, H01L 21302

Patent

active

060339969

ABSTRACT:
Etching residue, etching mask and silicon nitride and/or silicon dioxide are etched or removed employing a composition containing a fluoride containing compound, water and certain organic solvents.

REFERENCES:
patent: 3676240 (1972-07-01), Retajczyk
patent: 3979241 (1976-09-01), Maeda et al.
patent: 4230523 (1980-10-01), Gagda
patent: 4267013 (1981-05-01), Iida et al.
patent: 4269654 (1981-05-01), Deckert et al.
patent: 4285763 (1981-08-01), Coldren
patent: 4325984 (1982-04-01), Galfo et al.
patent: 4334349 (1982-06-01), Aoyama et al.
patent: 4351696 (1982-09-01), Radigan
patent: 4395304 (1983-07-01), Kern et al.
patent: 4444618 (1984-04-01), Saia et al.
patent: 4472237 (1984-09-01), Deslauriers et al.
patent: 4547260 (1985-10-01), Takada et al.
patent: 4692205 (1987-09-01), Sachdev et al.
patent: 4899767 (1990-02-01), McConnell et al.
patent: 4962049 (1990-10-01), Chang et al.
patent: 4971715 (1990-11-01), Armant et al.
patent: 4985113 (1991-01-01), Fujimoto et al.
patent: 4985990 (1991-01-01), Cronin et al.
patent: 4987101 (1991-01-01), Kaanta et al.
patent: 5012692 (1991-05-01), Nagano
patent: 5037506 (1991-08-01), Gupta et al.
patent: 5082518 (1992-01-01), Molinaro
patent: 5139624 (1992-08-01), Searson et al.
patent: 5217570 (1993-06-01), Kadomura
patent: 5308440 (1994-05-01), Chino et al.
patent: 5334332 (1994-08-01), Lee
patent: 5338416 (1994-08-01), Mlcak et al.
patent: 5348619 (1994-09-01), Bohannon et al.
patent: 5348627 (1994-09-01), Propst et al.
patent: 5350488 (1994-09-01), Webb
patent: 5387361 (1995-02-01), Kohara et al.
patent: 5407860 (1995-04-01), Stoltz et al.
patent: 5419779 (1995-05-01), Ward
patent: 5431766 (1995-07-01), Propst et al.
patent: 5461003 (1995-10-01), Havemann et al.
patent: 5468342 (1995-11-01), Nulty et al.
patent: 5475267 (1995-12-01), Ishii et al.
patent: 5533635 (1996-07-01), Man
patent: 5544776 (1996-08-01), Okuda et al.
patent: 5556482 (1996-09-01), Ward et al.
patent: 5571447 (1996-11-01), Ward et al.
patent: 5591299 (1997-01-01), Seaton et al.
patent: 5650041 (1997-07-01), Gotoh et al.
patent: 5698503 (1997-12-01), Ward et al.
patent: 5709756 (1998-01-01), Ward et al.
patent: 5780363 (1998-07-01), Delehanty et al.
El-Kareh, B., Fundamentals of Semiconductor Processing Technologies, Kluwer Academic Publishers, Norwell, MA, 1995: 565-571.
Anon, Flush Fluids for Ink Jet Ink Devices, Research Disclosure, Jan. 1991, No. 321.
"Etching SiO.sub.2 Films In Aqueous 0.49% HF", Somashekhar et al, J. Electrochem. Soc., vol. 143, No. 9, pp. 2885-2891, Sep. 1996.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Process for removing etching residues, etching mask and silicon does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for removing etching residues, etching mask and silicon , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for removing etching residues, etching mask and silicon will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-362717

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.