Process for producing a chip using a mold

Details Process for producing a chip using a mold Process for producing a chip using a mold

2011-07-19

2011-07-19

Tran, Binh X (Department: 1713)

Etching a substrate: processes

Masking of a substrate using material resistant to an etchant

C264S401000

Reexamination Certificate

active

07981304

ABSTRACT:
A mold capable of a highly accurate alignment with a member to be processed in such a state that a photocurable resin material is disposed between the mold and the member to be processed, and is constituted by a substrate2010formed of a first material and an alignment mark2102formed of a second material different from the first material. The first material and the second material have transmissivities to light in a part of an ultraviolet wavelength range. The second material has a refractive index of not less than 1.7.

REFERENCES:
patent: 5772905 (1998-06-01), Chou
patent: 5838653 (1998-11-01), Fan et al.
patent: 6334960 (2002-01-01), Willson et al.
patent: 6696220 (2004-02-01), Bailey et al.
patent: 6719915 (2004-04-01), Willson et al.
patent: 6916511 (2005-07-01), Lee et al.
patent: 7037639 (2006-05-01), Voisin
patent: 7070405 (2006-07-01), Sreenivasan et al.
patent: 2003/0170053 (2003-09-01), Montelius et al.
patent: 2003/0205658 (2003-11-01), Voisin
patent: 2004/0008334 (2004-01-01), Sreenivasan et al.
patent: 2004/0115568 (2004-06-01), Schmidt
patent: 2004/0141168 (2004-07-01), Sreenivasan et al.
patent: 2005/0064344 (2005-03-01), Bailey et al.
patent: 2005/0067379 (2005-03-01), Sreenivasan et al.
patent: 2007/0090574 (2007-04-01), Terasaki et al.
patent: 2000-323461 (2000-11-01), None
patent: 2003-272998 (2003-09-01), None
patent: 2004-148494 (2004-05-01), None
patent: 2004-200664 (2004-07-01), None
patent: 2005/040932 (2005-05-01), None
Michael J. O'Leary, et al, Characterization of reactively evaporated SIOx thin films, 1987, J. Vac. Sci. Technol.Jan./Feb. A 5(1), p. 106-109.
S.M.A. Durrani et al., “Characterization of Thin Films of a-SiOx (1.1 < x < 2.0) Prepared by Reactive Evaporation of SiO,” 15 J. Phys.: Condens. Matter 8123-35 (2003).
Michael J. O'Leary et al., “Characterization of Reactively Evaporated SiOx Thin Films,” 5(1) J. Vac. Sci. Technol. A 106-09 (Jan./Feb. 1987).

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