Process for integrating a MOSFET device, using silicon nitride s

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

438595, H01L 218242

Patent

active

057669929

ABSTRACT:
A semiconductor fabrication process, allowing integration of MOSFET devices, and capacitor structures, on a single semiconductor chip, has been developed. The process integration features the use of a MOSFET device, fabricated using a self-aligned contact structure, allowing a reduction in the source and drain area needed for contact. Silicon nitride spacers, used on the sides of the polysilicon gate electrode, protect the polysilicon gate structure, during the opening of a self-aligned contact hole.

REFERENCES:
patent: 4960723 (1990-10-01), Davies
patent: 5030585 (1991-07-01), Gonzalez et al.
patent: 5155056 (1992-10-01), Jeong-Gyoo
patent: 5296400 (1994-03-01), Park et al.
patent: 5364804 (1994-11-01), Ho et al.
patent: 5395784 (1995-03-01), Lu et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Process for integrating a MOSFET device, using silicon nitride s does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for integrating a MOSFET device, using silicon nitride s, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for integrating a MOSFET device, using silicon nitride s will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1725380

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.