Process for cleaning a semiconductor wafer using a cleaning...

Details Process for cleaning a semiconductor wafer using a cleaning... Process for cleaning a semiconductor wafer using a cleaning...

2011-05-10

2011-05-10

Kornakov, Michael (Department: 1714)

Cleaning and liquid contact with solids

Processes

Using sequentially applied treating agents

C134S026000, C134S027000, C134S029000, C134S002000, C134S003000

Reexamination Certificate

active

07938911

ABSTRACT:
Semiconductor wafers are cleaned using a cleaning solution containing an alkaline ammonium component in an initial composition, wherein the semiconductor wafer is brought into contact with the cleaning solution in an individual-wafer treatment, and in the course of cleaning hydrogen fluoride is added as further component to the cleaning solution, and the cleaning solution has at the end of cleaning, a composition that differs from the initial composition.

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