Probeless testing of pad buffers on wafer

Details Probeless testing of pad buffers on wafer Probeless testing of pad buffers on wafer

2007-08-14

2007-08-14

Lamarre, Guy (Department: 2138)

Error detection/correction and fault detection/recovery

Pulse or data error handling

Digital logic testing

C714S724000, C326S016000

Reexamination Certificate

active

10806539

ABSTRACT:
The peripheral circuitry (350, 360, ESD, BH) of an integrated circuit die on a wafer is tested without physically contacting the bond pads of the die.

REFERENCES:
patent: 6199182 (2001-03-01), Whetsel

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