Polishing pad ironing system

Details Polishing pad ironing system Polishing pad ironing system

2005-05-24

2005-05-24

Wilson, Lee D. (Department: 3723)

Abrading

Abrading process

With tool treating or forming

C451S021000, C451S054000, C451S285000, C451S443000

Reexamination Certificate

active

06896596

ABSTRACT:
An ironing assembly for use in chemical mechanical planarization (CMP) is provided. The ironing assembly is designed for use over a linear polishing pad which has a plurality of asperities and applied slurry. The ironing assembly includes an ironing disk having a contact surface. The ironing disk is oriented over the linear polishing pad such that the contact surface of the ironing disk can be applied over the surface of the linear polishing pad to at least partially flatten the plurality of asperities before planarizing a semiconductor wafer surface over the linear polishing pad.

REFERENCES:
patent: 5975994 (1999-11-01), Sandhu et al.
patent: 6001008 (1999-12-01), Fujimori et al.
patent: 6066029 (2000-05-01), Kondo
patent: 6116997 (2000-09-01), Hakomori et al.
patent: 6390900 (2002-05-01), Susnjara
patent: 6402596 (2002-06-01), Hakomori et al.
patent: 6447374 (2002-09-01), Sommer et al.

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