Plasma-inert cover and plasma cleaning process

Details Plasma-inert cover and plasma cleaning process Plasma-inert cover and plasma cleaning process

1994-07-06

1998-01-06

Tung, T.

Etching a substrate: processes

Gas phase etching of substrate

Application of energy to the gaseous etchant or to the...

1566431, 1566461, 216 79, 427585, H01L 2100

Patent

active

057050805

ABSTRACT:
A process for removing deposits from within a space at least partially delimited by a surface which is subject to attack from a plasma includes the steps of placing on the surface a cover comprising a material which is inert to the plasma, and then removing the deposits.

REFERENCES:
patent: 4397724 (1983-08-01), Moran
patent: 4473455 (1984-09-01), Dean et al.
patent: 4633812 (1987-01-01), Fujiyama
patent: 5047115 (1991-09-01), Charlet et al.
patent: 5207836 (1993-05-01), Chang
patent: 5240555 (1993-08-01), Kilburn
patent: 5405491 (1995-04-01), Shahuandi et al.
Anon., "Thermally Conductive Electrical Isolation Wafer," Derwent Publications Ltd., London; Class L03, AN 89-098219, Abstract and Research Dsclosure, vol. 298, No. 043, 10 Feb. 1989, Emsworth, GB.

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