Semiconductor device manufacturing: process – Introduction of conductivity modifying dopant into... – Plasma
Reexamination Certificate
2011-07-05
2011-07-05
Nguyen, Thinh T (Department: 2818)
Semiconductor device manufacturing: process
Introduction of conductivity modifying dopant into...
Plasma
C438S514000, C438S515000, C118S665000
Reexamination Certificate
active
07972945
ABSTRACT:
A top plate, disposed on an upper portion of a vacuum container so as to face a substrate-placing area of a sample electrode, is provided with an impurity-containing film that contains an impurity, and is formed on a top plate peripheral edge portion area that is a face exposable to a plasma generated in the vacuum container, and is located on a peripheral edge of a top plate center portion area that faces the center portion of the substrate-placing area.
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Notification of Transmittal of English translation of International Preliminary Report on Patentability issued in International Application No. PCT/JP2008/003705 filed Dec. 11, 2008.
Mizuno Bunji
Okashita Katsumi
Sasaki Yuichiro
McDermott Will & Emery LLP
Nguyen Thinh T
Panasonic Corporation
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