Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Patent
1999-03-22
2000-07-04
Baxter, Janet
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
430325, G03F 740
Patent
active
060836652
ABSTRACT:
A proposal is made for the photolithographic formation of a patterned resist layer on a substrate without the troubles due to reflection of the exposure light on the substrate surface. Thus, patterning is conducted on a photo-resist laminate comprising (a) a substrate; (b) a specific anti-reflection coating layer formed on one surface of the substrate; and (c) a photoresist layer formed on the anti-reflection coating layer from a specific negative-working chemical-sensitization photoresist composition. The patterning procedure comprises the steps of: (A) exposing, pattern-wise to actinic rays, the photoresist layer of the photoresist laminate; (B) subjecting the photoresist layer to a heat treatment; (C) subjecting the photoresist layer to a development treatment to dissolve away the photoresist layer in the areas unexposed to actinic rays in step (A) so as to expose bare the anti-reflection coating layer in the areas unexposed to the actinic rays leaving a patterned resist layer in the areas exposed to the actinic rays; and (D) removing the pattern-wise exposed anti-reflection coating layer by dry etching with the patterned photoresist layer as a mask.
REFERENCES:
patent: 4540598 (1985-09-01), Berner et al.
patent: 4736055 (1988-04-01), Dietliker et al.
patent: 5019488 (1991-05-01), Mammato et al.
patent: 5126289 (1992-06-01), Ziger
patent: 5605775 (1997-02-01), Watanabe
patent: 5627011 (1997-05-01), Munzel et al.
patent: 5650262 (1997-07-01), Munzel et al.
patent: 5693691 (1997-12-01), Flaim et al.
patent: 5892095 (1999-04-01), Hada et al.
patent: 5902713 (1999-05-01), Hada et al.
Iguchi Etsuko
Ishikawa Kiyoshi
Kaneko Fumitake
Nakayama Toshimasa
Oomori Katsumi
Ashton Rosemary
Baxter Janet
Tokyo Ohka Kogyo Co. Ltd.
LandOfFree
Photoresist laminate and method for patterning using the same does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Photoresist laminate and method for patterning using the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Photoresist laminate and method for patterning using the same will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1484771