Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Reexamination Certificate
2005-01-11
2005-01-11
Huff, Mark F. (Department: 1756)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
C430S322000, C430S396000, C430S005000, C430S270100
Reexamination Certificate
active
06841338
ABSTRACT:
A photoresist composition may include formulas 1 and 2: where R is an acetal group or a ter-butyloxy carbonyl (t-BOC) group, n and m are integers, n/(m+n) is 0.01−0.8, and m/(m+n) is 1−[n/(m+n)], where r is an integer between 8-40.A method for forming photoresist patterns may include forming a photoresist layer on a semiconductor substrate and exposing and developing the photoresist layer using a mask pattern that includes first areas having a light transmissivity of about 100% and second areas having a light transmissivity of between about 10% and about 30%.
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Lee Dae-youp
Lee Jeung-woo
Nam Jeong-lim
Yoo Do-yul
Chacko-Davis Daborah
Huff Mark F.
Myers Bigel & Sibley & Sajovec
Samsung Electronics Co,. Ltd.
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