Pattern and fabricating method therefor, device and...

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Multiple layers

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C427S470000, C257SE21174

Reexamination Certificate

active

10840296

ABSTRACT:
A method for fabricating a pattern on a substrate, includes the steps of forming banks according to formation areas of the pattern on the substrate, disposing a first function liquid between the banks, disposing a second function liquid on the first function liquid, and applying predetermined treatments to the first and the second function liquids which are disposed between the banks so as to form the pattern with plural materials stacked one on the other.

REFERENCES:
patent: 5132248 (1992-07-01), Drummond et al.
patent: 6610552 (2003-08-01), Fujimori et al.
patent: 6667443 (2003-12-01), Kondo et al.
patent: 6905906 (2005-06-01), Sirringhaus et al.
patent: 2001/0001050 (2001-05-01), Miyashita et al.
patent: 2003/0030689 (2003-02-01), Hashimoto et al.
patent: 2003/0059987 (2003-03-01), Sirringhaus et al.
patent: 2003/0083203 (2003-05-01), Hashimoto et al.
patent: 2003/0143339 (2003-07-01), Kobayashi
patent: 2005/0196969 (2005-09-01), Gunner et al.
patent: 090130808 (1992-05-01), None
patent: 1320011 (2001-10-01), None
patent: 0 862 156 (1998-09-01), None
patent: 0 930 641 (1999-07-01), None
patent: 1 357 772 (2003-10-01), None
patent: A 5-265040 (1993-10-01), None
patent: A 10-161093 (1998-06-01), None
patent: HEI 11-274671 (1999-10-01), None
patent: 2000-216330 (2000-08-01), None
patent: A 2002-164635 (2002-06-01), None
patent: A 2003-059940 (2003-02-01), None
patent: A 2003-124215 (2003-04-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Pattern and fabricating method therefor, device and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Pattern and fabricating method therefor, device and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Pattern and fabricating method therefor, device and... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3787093

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.