Padless substrate for surface mounted components

Details Padless substrate for surface mounted components Padless substrate for surface mounted components

2011-06-28

2011-06-28

Ward, Jessica L (Department: 1735)

Metal fusion bonding

Process

Plural joints

C361S767000

Reexamination Certificate

active

07967184

ABSTRACT:
A semiconductor package having a low profile is disclosed. In embodiments, a surface mounted component may be mounted directly to the core of the semiconductor package substrate, so that there is no conductive layer, plating layers or solder paste between the component and the substrate core. The surface mounted component may be any type of component which may be surface mounted on a substrate according to an SMT process, including for example passive components and various packaged semiconductors.

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