Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Smart card package
Inventor
active
Ball grid array package with interdigitated power ring and...
Chip package capable of reducing moisture penetration
Chip package capable of reducing moisture penetration
Die package with asymmetric leadframe connection
High density three dimensional semiconductor die package
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Profile ID: LFUS-PAI-P-2279094